报告人：Huey Tyng Cheong（马来西亚双威大学数学科学学院）
报告时间：2024年3月22日10:00
报告地点：东校区3201
报告摘要：Electrical appliances and electronic devices with compact designs are trending nowadays. However, there is always a drawback for electronic devices is the heat generation during operation, in which excessive heat generated might lead to malfunction of the device or even worse. Hence, developing electronics with high performance and yet effective cooling is crucial. Therefore, understanding the phenomena of fluid flow and heat transfer processes in enclosures is important in many engineering and industrial applications, as most electrical appliances and electronic devices are confined within their outer container. The geometry of the system, that is, the shape and size of the enclosure and boundary wall temperatures, can be the factors that provide optimal heat transfer for various engineering applications. Hence, the effects of the enclosure’s shape and aspect ratio will be the subjects of the present study. A porous enclosure filled with fluid is considered. The enclosure’s left side wall is heated at a higher temperature while the right side wall is cooled at a lower temperature. The top and bottom walls are insulated. The governing equations and boundary conditions are derived from the proposed physical model. The governing system of partial differential equations is non-dimensionalized, using suitable dimensionless variables to reduce the complexity of physical quantities involved in solving the system. An appropriate numerical algorithm is developed to find the numerical solutions of heat transfer and fluid flow in the enclosures. This study will provide new understanding and algorithms that benefit engineering application designs.
报告人简介：
Huey Tyng Cheong, 博士，马来西亚双威大学数学科学学院副院长、数学精算科学负责人。2017年博士毕业于马来亚大学数学专业。主持马来西亚高等教育部等项目7项，指导博士生2名，硕士生10余名。在《Journal of Optimization Theory and Applications》、《Numerical Heat Transfer》、《International Communications in Heat and Mass Transfer》等国际著名学术期刊上发表论文20余篇，2019年获马来西亚双威大学杰出研究奖。
